3D technology integrates a circuit structure into injection-moulded parts. Through the use of thermoplastic material and its metallisation, 3D circuit carriers can be manufactured which combine electrical and mechanical functions. While flexible and rigid-flexible printed circuit boards are ultimately only spatially fitted in the final application, the MID components are manufactured and assembled in 3D.
This integration of the functionalities opens up completely new approaches in the system development which can now be realised on an economical basis, saving space and resources. In this respect, 3D-MID technology enables intelligent, advantageous and elegant solutions.
- The items we manufacture are subject to confidentiality and cannot be shown.
LÜBERG ELEKTRONIK is an experienced provider of 3D-MID projects in all process steps and offers a full and versatile service in MID technology, from professional advice on materials and design through to the creation of prototypes and the series production and fitting.
LÜBERG ELEKTRONIK offers a full and versatile service in MID technology, from professional advice through to the creation of prototypes and the series production and fitting.
Environment-friendliness / Sustainability
Contact our Sales Team. You will always be advised by engineers. Together we will find a solution for you which is both functional and optimized to meet your specific requirements. We look forward to hearing from you.
Contact partner for sales:
Tel. +49 - (0)9 61 - 38 15 9 - 30
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